Multilayer electronic component

ABSTRACT

A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2019-0113941 filed on Sep. 17, 2019 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a type of multilayer electroniccomponent, may be a chip type capacitor mounted on a printed circuitboard of various electronic products such as imaging devices includingliquid crystal displays (LCDs), plasma display panels (PDPs), and thelike, and computers, smartphones, mobile phones, and the like, servingto charge or discharge electricity therein or therefrom.

Such multilayer ceramic capacitors may be used as components of variouselectronic devices due to their relatively small size, relatively highcapacity, and relative ease of mounting. As various electronic devicessuch as computers, mobile devices, or the like are miniaturized andincreased in terms of output, demand for miniaturization and highcapacity of multilayer ceramic capacitors are increasing.

In addition, as recent interest in vehicle electric/electroniccomponents has increased, multilayer ceramic capacitors have also cometo require relatively high reliability and relatively high strength tobe used in vehicle or infotainment systems.

In order to secure high capacity in multilayer ceramic capacitors, thenumber of stacked layers therein should be increased. However, as thenumber of stacked layers therein increases, delamination of the capacityforming portion and the protective layer may occur, or cracking mayoccur during the plasticizing process.

Accordingly, there may be a demand for development of a multilayerceramic capacitor capable of suppressing the occurrence of delaminationof the capacity forming portion and the protective layer, the occurrenceof cracking, or the like.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component having improved mechanical strength.

An aspect of the present disclosure is to provide a multilayerelectronic component having excellent reliability for moistureresistance.

An aspect of the present disclosure is to suppress occurrence ofdelamination of a capacity forming portion and a cover portion,occurrence of cracking, or the like.

An aspect of the present disclosure is to prevent poor contact betweenan internal electrode and an external electrode.

However, the objects of the present disclosure are not limited to theabove description, and will be more easily understood in the process ofdescribing specific embodiments of the present disclosure.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body comprising dielectric layers, andfirst and second internal electrode layers alternately stacked in astacking direction with respective dielectric layers interposedtherebetween, and comprising first and second surfaces opposing eachother in the stacking direction, third and fourth surfaces connected tothe first and second surfaces and opposing each other, and fifth andsixth surfaces connected to the first to fourth surfaces and opposingeach other; and first and second external electrodes arranged on thethird and fourth surfaces, respectively. The first internal electrodelayer comprises first and second internal electrodes exposed from thethird surface and arranged with a first spacer interposed therebetween,a first lead portion connected to the first internal electrode andexposed from the third and sixth surfaces, and a second lead portionconnected to the second internal electrode and exposed from the thirdand fifth surfaces, and the second internal electrode layer comprisesthird and fourth internal electrodes exposed from the fourth surface andarranged with a second spacer interposed therebetween, a third leadportion connected to the third internal electrode and exposed from thefourth and sixth surfaces, and a fourth lead portion connected to thefourth internal electrode and exposed from the fourth and fifthsurfaces.

According to another aspect of the present disclosure, a multilayerelectronic component includes a body comprising dielectric layers, andfirst and second internal electrode layers alternately stacked in astacking direction with respective dielectric layers interposedtherebetween, and comprising first and second surfaces opposing eachother in the stacking direction, third and fourth surfaces connected tothe first and second surfaces and opposing each other, and fifth andsixth surfaces connected to the first to fourth surfaces and opposingeach other; and first and second external electrodes arranged on thethird and fourth surfaces, respectively. The first internal electrodelayer comprises first and second internal electrodes arranged with afirst spacer interposed therebetween, a first lead portion connected tothe first internal electrode and exposed from the third and sixthsurfaces, and a second lead portion connected to the second internalelectrode and exposed from the fourth and fifth surfaces, and the secondinternal electrode layer comprises third and fourth internal electrodesarranged with a second spacer interposed therebetween, a third leadportion connected to the third internal electrode and exposed from thefourth and sixth surfaces, and a fourth lead portion connected to thefourth internal electrode and exposed from the third and fifth surfaces.The first and fourth internal electrodes are exposed from the thirdsurface, and the second and third internal electrodes are exposed fromthe fourth surface.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a multilayerelectronic component according to an embodiment of the presentdisclosure.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

FIG. 3 is an exploded perspective view schematically illustrating anexploded body according to an embodiment of the present disclosure.

FIG. 4 is a perspective view illustrating the body of FIG. 1.

FIG. 5 is a perspective view of the body of FIG. 4, when viewed fromanother direction.

FIG. 6 is a plan view of a first internal electrode layer according toan embodiment of the present disclosure.

FIG. 7 is a plan view of a second internal electrode layer according toan embodiment of the present disclosure.

FIG. 8 is an exploded perspective view schematically illustrating anexploded body according to a first modification of the presentdisclosure.

FIG. 9 is a perspective view of a body according to a first modificationof the present disclosure.

FIG. 10 is a perspective view of the body of FIG. 9, when viewed fromanother direction.

FIG. 11 is a plan view of a first internal electrode layer according toa first modification of the present disclosure.

FIG. 12 is a plan view of a second internal electrode layer according toa first modification of the present disclosure.

FIG. 13 is a plan view of a third internal electrode layer included in asecond modification of the present disclosure.

FIG. 14 is a plan view of a fourth internal electrode layer included ina second modification of the present disclosure.

FIG. 15 is an exploded perspective view schematically illustrating anexploded body of a multilayer electronic component according to anotherembodiment of the present disclosure.

FIG. 16 is a perspective view illustrating a body of a multilayerelectronic component according to another embodiment of the presentdisclosure.

FIG. 17 is a perspective view of the body of FIG. 16, when viewed fromanother direction.

FIG. 18 is a plan view of a first internal electrode layer according toanother embodiment of the present disclosure.

FIG. 19 is a plan view of a second internal electrode layer according toanother embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified intovarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to the ordinary artisan. Therefore, shapes andsizes of the elements in the drawings may be exaggerated for clarity ofdescription, and the elements denoted by the same reference numerals inthe drawings may be the same elements.

In the drawings, portions not related to the description will be omittedfor clarification of the present disclosure, and a thickness may beenlarged to clearly show layers and regions. The same reference numeralswill be used to designate the same components in the same referencenumerals. Further, throughout the specification, when an element isreferred to as “comprising” or “including” an element, it means that theelement may further include other elements as well, without departingfrom the other elements, unless specifically stated otherwise.

In the drawing, an X direction may be defined as a second direction, anL direction, or a longitudinal direction, a Y direction may be definedas a third direction, a W direction, or a width direction, and a Zdirection may be defined as a first direction, a stacking direction, a Tdirection, or a thickness direction.

Multilayer Electronic Component

FIG. 1 is a perspective view schematically illustrating a multilayerelectronic component according to an embodiment of the presentdisclosure.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

FIG. 3 is an exploded perspective view schematically illustrating anexploded body according to an embodiment of the present disclosure.

FIG. 4 is a perspective view illustrating the body of FIG. 1.

FIG. 5 is a perspective view of the body of FIG. 4, when viewed fromanother direction.

FIG. 6 is a plan view of a first internal electrode layer according toan embodiment of the present disclosure.

FIG. 7 is a plan view of a second internal electrode layer according toan embodiment of the present disclosure.

Hereinafter, a multilayer electronic component 100 according to anembodiment of the present disclosure will be described with reference toFIGS. 1 to 7.

A multilayer electronic component 100 according to an embodiment of thepresent disclosure may include a body 110 including dielectric layers111, and first and second internal electrode layers alternately stackedin a stacking direction with respective dielectric layers interposedtherebetween, and including first and second surfaces 1 and 2 opposingeach other in the stacking direction, third and fourth surfaces 3 and 4connected to the first and second surfaces and opposing each other, andfifth and sixth surfaces 5 and 6 connected to the first to fourthsurfaces and opposing each other; and first and second externalelectrodes 131 and 132 arranged on the third and fourth surfaces,respectively. The first internal electrode layer includes first andsecond internal electrodes 121 and 122 exposed from the third surface 3and arranged with a first spacer G1 interposed therebetween, a firstlead portion 121 a connected to the first internal electrode 121 andexposed from the third and sixth surfaces 3 and 6, and a second leadportion 122 a connected to the second internal electrode 122 and exposedfrom the third and fifth surfaces 3 and 5, and the second internalelectrode layer includes third and fourth internal electrodes 123 and124 exposed from the fourth surface 4 and arranged with a second spacerG2 interposed therebetween, a third lead portion 123 a connected to thethird internal electrode 123 and exposed from the fourth and sixthsurfaces 4 and 6, and a fourth lead portion 124 a connected to thefourth internal electrode 124 and exposed from the fourth and fifthsurfaces 4 and 5.

The body 110 may include the dielectric layers 111 and the first andsecond internal electrode layers alternately stacked with the respectivedielectric layers 111 interposed therebetween.

Although the specific shape of the body 110 is not particularly limited,as illustrated, the body 110 may have a hexahedral shape or the like.Due to shrinkage of ceramic powder contained in the body 110 during afiring process, the body 110 may not have a perfectly hexahedral shapewith completely straight lines, but may have a substantially hexahedralshape overall.

The body 110 may have the first and second surfaces 1 and 2 opposingeach other in the thickness direction (the Z direction), the third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and opposing each other in the longitudinal direction (the Xdirection), and the fifth and sixth surfaces 5 and 6 connected to thefirst and second surfaces 1 and 2, connected to the third and fourthsurfaces 3 and 4, and opposing each other in the width direction (the Ydirection).

Referring to FIG. 4, a distance between the first surface 1 and thesecond surface 2 may be defined as a thickness T of the body, a distancebetween the third surface 3 and the fourth surface 4 may be defined as alength L of the body, and a distance between the fifth surface 5 and thesixth surface 6 may be defined as a width W of the body.

The plurality of dielectric layers 111 forming the body 110 may be in afired state, and a boundary between adjacent dielectric layers 111 maynot be apparent without using a scanning electron microscope (SEM).

According to one embodiment of the present disclosure, the raw materialfor forming the dielectric layer 111 is not particularly limited, aslong as sufficient capacitance may be obtained. For example, a bariumtitanate-based material, a lead composite perovskite-based material, astrontium titanate-based material, or the like may be used. The bariumtitanate-based material may include a BaTiO₃-based ceramic powder, andexamples of the ceramic powder may include BaTiO₃, or(Ba_(1-x)Ca_(x))TiO₃, Ba (Ti_(1-y)Ca_(y))O₃, (Ba_(1-x)Ca_(x))(Ti_(1-y)Zr_(y))O₃, Ba (Ti_(1-y)Zr_(y)) O₃, in which calcium (Ca),zirconium (Zr), or the like is partially dissolved into BaTiO₃, or thelike.

Various ceramic additives, organic solvents, plasticizers, binders,dispersants, or the like may be added to the powder of barium titanate(BaTiO₃), and the like, according to the purpose of the presentdisclosure, as the material for forming the dielectric layer 111.

The body 110 may include a capacity forming portion disposed in the body110 and including the first and second internal electrode layers,disposed to oppose each other with the dielectric layer 111 interposedtherebetween, to form capacity, an upper protective layer 112 disposedabove the capacity forming portion, and a lower protective layer 113disposed below the capacity forming portion.

The capacity forming portion may contribute to capacity formation of acapacitor, and may be formed by repeatedly stacking the plurality offirst and second internal electrode layers with the dielectric layer 111interposed therebetween.

The upper protective layer 112 and the lower protective layer 113 may beformed by stacking the single dielectric layer or the two or moredielectric layers on upper and lower surfaces of the capacity formingportion, respectively, in the vertical direction, and may basically playa role in preventing damage to the internal electrodes due to physicalor chemical stress.

The upper protective layer 112 and the lower protective layer 113 maynot include an internal electrode, and may include the same material asthe dielectric layer 111.

Referring to FIGS. 4 to 7, the first internal electrode layer mayinclude the first and second internal electrodes 121 and 122 exposedfrom the third surface 3 and arranged with the first spacer G1interposed therebetween, the first lead portion 121 a connected to thefirst internal electrode 121 and exposed from the third and sixthsurfaces 3 and 6, and the second lead portion 122 a connected to thesecond internal electrode 122 and exposed from the third and fifthsurfaces 3 and 5.

The second internal electrode layer may include the third and fourthinternal electrodes 123 and 124 exposed from the fourth surface 4 andarranged with the second spacer G2 interposed therebetween, the thirdlead portion 123 a connected to the third internal electrode 123 andexposed from the fourth and sixth surfaces 4 and 6, and the fourth leadportion 124 a connected to the fourth internal electrode 124 and exposedfrom the fourth and fifth surfaces 4 and 5.

The first and second spacers G1 and G2 may serve to improve mechanicalstrength. In addition, the first and second spacers G1 and G2 may serveto allow the dielectric to dominate the overall sintering force, ratherthan the internal electrode. Therefore, the occurrence of delaminationand cracking may be suppressed effectively.

In a conventional multilayer electronic component having only oneinternal electrode in one internal electrode layer without the first andsecond spacers G1 and G2, there is a problem in that a delamination mayoccur or a cracking may occur in the plasticizing process.

This problem may occur because the internal electrode and the dielectriclayer have materials different from each other and a bonding strengthbetween the internal electrode and the dielectric layer is relativelylow. Due to a limitation of the bonding force between the internalelectrode and the dielectric layer, the delamination and cracking mayoccur due to friction in blades during a cutting process and collisionsbetween chips during a green polishing process.

Since the first and second spacers G1 and G2 according to the presentdisclosure are included, the dielectric layers disposed above and belowthe first internal electrode layer may be connected to each otherthrough the first spacer G1, and the dielectric layers disposed aboveand below the second internal electrode layer may be connected to eachother through the second spacer G2. Therefore, it is possible to improvethe mechanical strength of the chips by increasing a junction areabetween homogeneous materials. It is also possible to allow thedielectric to dominate the overall sintering force, rather than theinternal electrode.

In addition, the dielectric layers disposed above and below the firstinternal electrode layer may be connected to each other by the firstspacer G1 during stacking and pressing processes, and the dielectriclayers disposed above and below the second internal electrode layer maybe connected to each other by the second spacer G2. Therefore, the firstand second spacers G1 and G2 may include a dielectric. In this case, thedielectric may be disposed in the first and second spacers G1 and G2.

Widths W1 and W2 of the first and second spacers G1 and G2 need not beparticularly limited. For example, the widths W1 and W2 of the first andsecond spacers G1 and G2 may be 5% or more and 30% or less of the widthW of the body, respectively.

When the widths W1 and W2 of the first and second spacers Gland G2 areless than 5% of the width W of the body, the effect of improving thebonding force between the dielectric layers may be insufficient. Whenthe widths W1 and W2 of the first and second spacers G1 and G2 exceed30% of the width W of the body, an area of overlap between the internalelectrodes may be reduced, thereby making it difficult to secure a highcapacity.

The first to fourth lead portions 121 a, 122 a, 123 a, and 124 a mayserve to improve connectivity between the internal electrodes 121, 122,123, and 124 and the external electrodes 131 and 132.

Since the internal electrodes 121, 122, 123, and 124 are spaced apart bythe spacers G1 and G2, contact areas between the internal electrodes121, 122, 123, and 124 and the external electrodes 131 and 132 may bereduced, to deteriorate the connectivity between the internal electrodes121, 122, 123, and 124 and the external electrodes 131, 132. Accordingto the present disclosure, since the first to fourth lead portions 121a, 122 a, 123 a, and 124 a may be connected to each of the internalelectrodes and arranged at one corner of the body, the connectivitybetween the internal electrodes 121, 122, 123, and 124 and the externalelectrodes 131 and 132 may be improved, and an equivalent seriesresistance (ESR) may be lowered.

The first and second internal electrodes 121 and 122 may be spaced apartfrom the fourth surface 4 and may be exposed from the third surface 3,and the third and fourth internal electrodes 123 and 124 may be spacedapart from the third surface 3 and may be exposed from the fourthsurface 4.

The first external electrode 131 may be disposed on the third surface 3of the body to be connected to the first and second internal electrodes121 and 122 and the first and second lead portions 121 a and 122 a. Thesecond external electrode 132 may be disposed on the fourth surface 4 tobe connected to the third and fourth internal electrodes 123 and 124 andthe third and fourth lead portions 123 a and 124 a.

The first internal electrode layer and the second internal electrodelayer may be electrically separated from each other by the dielectriclayer 111 disposed therebetween.

Referring to FIG. 3, the body 110 may be formed by alternately stackingthe dielectric layer 111 on which the first internal electrode layer isprinted, and the dielectric layer 111 on which the second internalelectrode layer is printed, in the thickness direction (the Zdirection), and then firing the same.

A material for forming the first to fourth internal electrodes 121, 122,123, and 124 is not particularly limited. For example, the first andsecond internal electrodes 121 and 122 may be formed by using aconductive paste containing one or more of nickel (Ni), copper (Cu),palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn),tungsten (W), titanium (Ti), and alloys thereof.

As a printing method of the conductive paste, a screen-printing methodor a gravure printing method may be used, but the present disclosure isnot limited thereto.

As illustrated in FIGS. 3 to 5, the first spacer G1 and the secondspacer G2 may be stacked to overlap each other. In addition, in order tocompensate for a step difference caused by thicknesses of the internalelectrodes, the first spacer G1 and the second spacer G2 may be alsostacked to partially overlap each other.

Also, referring to FIG. 2, as the first spacer G1 and the second spacerG2 are arranged in a central portion in the width direction and stackedto overlap each other, the internal electrode may not be observed in across-section in the length and thickness directions, cut in the centralportion in the width direction.

The first external electrode 131 may be disposed on the third surface 3of the body to be connected to the first and second internal electrodes121 and 122 and the first and second lead portions 121 a and 122 a. Thesecond external electrode 132 may be disposed on the fourth surface 4 tobe connected to the third and fourth internal electrodes 123 and 124 andthe third and fourth lead portions 123 a and 124 a.

The first external electrode 131 may be disposed to extend from thethird surface 3 to a portion of the fifth and sixth surfaces 5 and 6,and the second external electrode 132 may be disposed to extend from thefourth surface 4 to a portion of the fifth and sixth surfaces 5 and 6.In addition, the first external electrode 131 may be disposed to extendfrom the third surface 3 to a portion of the first, second, fifth, andsixth surfaces 1, 2, 5, and 6, and the second external electrode 132 maybe disposed to extend from the fourth surface 4 to a portion of thefirst, second, fifth, and sixth surfaces 1, 2, 5, and 6.

In this case, a portion in which the external electrodes 131 and 132 arearranged to extend to the first, second, fifth, and sixth surfaces 1, 2,5, and 6 may be defined as a bent portion of the external electrodes 131and 132.

The bent portion of the first external electrode 131 may contact thefirst and second lead portions 121 a and 122 a, and the bent portion ofthe second external electrode 132 may contact the third and fourth leadportions 123 a and 124 a. As a result, the connectivity between theinternal electrodes 121, 122, 123, and 124 and the external electrodes131 and 132 may be improved, and the equivalent series resistance (ESR)may be lowered.

The external electrodes 131 and 132 may be formed using any material, aslong as they have electrical conductivity such as a metal. In addition,a specific material may be selected as the external electrodes 131 and132 in consideration of electrical characteristics, structuralstability, or the like. Furthermore, the external electrodes 131 and 132may have a multilayer structure.

For example, the external electrodes 131 and 132 may be sinteredelectrodes including a conductive metal and a glass, or resin-basedelectrodes including a conductive metal and a resin.

In addition, the external electrodes 131 and 132 may be formed using anatomic layer deposition (ALD) process, a molecular layer deposition(MLD) process, a chemical vapor deposition (CVD) process, a sputteringprocess, or the like.

In addition, the external electrodes 131 and 132 may be formed bytransferring a sheet including a conductive metal on the body 110.

Referring to FIG. 2, as a specific example of the external electrodes131 and 132, the external electrodes 131 and 132 may respectivelyinclude electrode layers 131 a and 132 a, conductive resin layers 131 band 132 b, and plating layers 131 c and 132 c, sequentially arranged onthe body 110.

In this case, the electrode layers 131 a and 132 a may include aconductive metal and glass.

The conductive metals included in the electrode layers 131 a and 132 aare not particularly limited, as long as they are materials that may beelectrically connected to the internal electrodes to form capacitance.For example, the conductive metals used for the electrode layers 131 aand 132 a may be one or more of nickel (Ni), copper (Cu), palladium(Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W),titanium (Ti), and alloys thereof.

A glass frit may be added to a conductive metal powder to prepare aconductive paste, and, then, the prepared conductive paste may besintered to form the electrode layers 131 a and 132 a.

In addition, the conductive resin layers 131 b and 132 b may includeconductive metals and base resins.

The conductive metals included in the conductive resin layers 131 b and132 b may serve to be electrically connected to the electrode layers 131a and 132 a.

The conductive metals included in the conductive resin layers 131 b and132 b are not particularly limited, as long as they are materials thatmay be electrically connected to the electrode layers 131 a and 132 a.For example, the conductive metals included in the conductive resinlayers 131 b and 132 b may be one or more of nickel (Ni), copper (Cu),palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn),tungsten (W), titanium (Ti), and alloys thereof.

The base resins contained in the conductive resin layers 131 b and 132 bmay play a role of securing bonding properties and absorbing impact.

The base resins contained in the conductive resin layers 131 b and 132 bare not particularly limited, as long as they have bonding propertiesand impact absorbing properties, and may be mixed with the conductivemetal powder to form a paste. For example, the base resins may beepoxy-based resins.

In addition, types of the plating layers 131 c and 132 c are notparticularly limited. For example, the plating layers 131 c and 132 cmay be plating layers containing one or more of nickel (Ni), tin (Sn),palladium (Pd), and alloys thereof, and may be formed of a plurality oflayers.

FIG. 8 is an exploded perspective view schematically illustrating anexploded body according to a first modification of the presentdisclosure.

FIG. 9 is a perspective view of a body according to a first modificationof the present disclosure.

FIG. 10 is a perspective view of the body of FIG. 9, when viewed fromanother direction.

FIG. 11 is a plan view of a first internal electrode layer according toa first modification of the present disclosure.

FIG. 12 is a plan view of a second internal electrode layer according toa first modification of the present disclosure.

Referring to FIGS. 8 to 12, a first spacer G1′ and a second spacer G2′may be stacked not to overlap each other.

When the first spacer and the second spacer are stacked to overlap eachother, a shape of a body may be uneven because step differences causedby thicknesses of the internal electrodes are overlapped each other.According to the first modification of the present disclosure, since thefirst spacer G1′ and the second spacer G2′ are stacked so as not tooverlap each other, even while the effect of improving the bonding forcebetween the dielectric layers by the spacers may be maintained, it ispossible to compensate for a step difference caused by thicknesses ofthe internal electrodes and to prevent a shape of the body 210 frombeing uneven.

In this case, a width W21 of a first internal electrode 221 and a widthW22 of a second internal electrode 222 may be different from each other,and a width W23 of a third internal electrode 223 and a width W24 of afourth internal electrode 224 may be different from each other.

Therefore, the first spacer G1′ and the second spacer G2′ may stackednot to overlap each other, while an area in which the first and secondinternal electrodes 221 and 222 and the third and fourth internalelectrodes 223 and 224 overlap is maintained. Therefore, it is possibleto compensate for the step difference caused by the internal electrodethickness while maintaining the capacity of the capacitor.

In this case, widths W21 a, W22 a, W23 a, and W24 a of first to fourthlead portions may be equal to each other, to maximize the area ofoverlap of the first and second internal electrodes 221 and 222 and thethird and fourth internal electrodes 223 and 224.

Lengths L21 a, L22 a, L23 a, and L24 a of the first to fourth leadportions are not particularly limited, as long as the first to fourthlead portions do not directly contact each other. For example, thelengths L21 a, L22 a, L23 a, and L24 a of the first to fourth leadportions may be shorter than lengths of bent portions of externalelectrodes 131 and 132.

FIG. 13 is a plan view of a third internal electrode layer included in asecond modification of the present disclosure.

FIG. 14 is a plan view of a fourth internal electrode layer included ina second modification of the present disclosure.

Referring to FIGS. 13 and 14, a body 110 according to a secondmodification of the present disclosure may further include at least oneof a third internal electrode layer including a fifth internal electrode125 exposed from the third surface 3, and a fourth internal electrodelayer including a sixth internal electrode 126 exposed from the fourthsurface 4. The fifth and sixth internal electrodes 125 and 126 may havea shape of an internal electrode included in a conventional multilayercapacitor, with reference to the structure of the body disclosed aboveand the structure of the body to be disclosed below.

Since the fifth internal electrode 125 and the sixth internal electrode126 may be arranged to oppose each other with a dielectric layer 111interposed therebetween, the fifth internal electrode 125 and the sixthinternal electrode 126 may serve to further improve the capacity of themultilayer electronic component according to the present disclosure.

FIG. 15 is an exploded perspective view schematically illustrating anexploded body of a multilayer electronic component according to anotherembodiment of the present disclosure.

FIG. 16 is a perspective view illustrating a body of a multilayerelectronic component according to another embodiment of the presentdisclosure.

FIG. 17 is a perspective view of the body of FIG. 16, when viewed fromanother direction.

FIG. 18 is a plan view of a first internal electrode layer according toanother embodiment of the present disclosure.

FIG. 19 is a plan view of a second internal electrode layer according toanother embodiment of the present disclosure.

Hereinafter, a multilayer electronic component according to anotherembodiment of the present disclosure will be described with reference toFIGS. 15 to 19. However, in order to avoid overlapping descriptions,descriptions common to the multilayer electronic component 100 accordingto the embodiment of the present disclosure may be omitted.

An external electrode of a multilayer electronic component according toanother embodiment of the present disclosure may have the same form asthe external electrodes 131 and 132 of the multilayer electroniccomponent 100 according to an embodiment of the present disclosure, anda perspective view of a multilayer electronic component according toanother embodiment of the present disclosure may be the same as that ofFIG. 1.

A multilayer electronic component according to another embodiment of thepresent disclosure may include a body 310 including dielectric layers111, and first and second internal electrode layers alternately stackedin a stacking direction with respective dielectric layers interposedtherebetween, and including first and second surfaces 1 and 2 opposingeach other in the stacking direction, third and fourth surfaces 3 and 4connected to the first and second surfaces and opposing each other, andfifth and sixth surfaces 5 and 6 connected to the first to fourthsurfaces and opposing each other; and first and second externalelectrodes 131 and 132 arranged on the third and fourth surfaces,respectively. The first internal electrode layer includes first andsecond internal electrodes 321 and 322 exposed from the third surfaceand arranged with a first spacer G1″ interposed therebetween, a firstlead portion 321 a connected to the first internal electrode and exposedfrom the third and sixth surfaces 3 and 6, and a second lead portion 322a connected to the second internal electrode and exposed from the fourthand fifth surfaces 4 and 6, and the second internal electrode layerincludes third and fourth internal electrodes 323 and 324 exposed fromthe fourth surface and arranged with a second spacer G2″ interposedtherebetween, a third lead portion 323 a connected to the third internalelectrode and exposed from the fourth and sixth surfaces 4 and 6, and afourth lead portion 324 a connected to the fourth internal electrode andexposed from the third and fifth surfaces 3 and 5. The first and fourthinternal electrodes 321 and 324 are exposed from the third surface 3,and the second and third internal electrodes 322 and 323 are exposedfrom the fourth surface 4.

The first internal electrode layer may include the first and secondinternal electrodes 321 and 322 arranged with the first spacer G1″interposed therebetween, the first lead portion 321 a connected to thefirst internal electrode 321 and exposed from the third and sixthsurfaces 3 and 6, and the second lead portion 322 a connected to thesecond internal electrode 322 and exposed from the fourth and fifthsurfaces 4 and 5.

The first internal electrode 321 may be exposed from the third surface 3to be connected to the first external electrode 131, and the secondinternal electrode 322 may be exposed from the fourth surface 4 to beconnected to the second external electrode 132.

Since the first and second internal electrodes 321 and 322 are arrangedwith the first spacer G1″ interposed therebetween, and thus are notelectrically connected to each other, the first internal electrode 321and the second internal electrode 322 included in the first internalelectrode layer may have different polarities.

The second internal electrode layer may include the third and fourthinternal electrodes 323 and 324 arranged with the second spacer G2″interposed therebetween, the third lead portion 323 a connected to thethird internal electrode 323 and exposed from the fourth and sixthsurfaces 4 and 6, and the fourth lead portion 324 a connected to thefourth internal electrode 324 and exposed from the third and fifthsurfaces 3 and 5.

The third internal electrode 323 may be exposed from the fourth surface4 to be connected to the second external electrode 132, and the fourthinternal electrode 324 may be exposed from the third surface 3 to beconnected to the first external electrode 131.

Since the third and fourth internal electrodes 323 and 324 are arrangedwith the second spacer G2″ interposed therebetween, and thus are notelectrically connected to each other, the third internal electrode 323and fourth internal electrode 324 included in the second internalelectrode layer may have different polarities.

In the conventional capacitor, internal electrodes having differentpolarities may be arranged only above and below the other internalelectrodes. In a multilayer electronic component according to anotherembodiment of the present disclosure, the capacity may be improved asinternal electrodes having different polarities may be arranged not onlyon above and below the other internal electrodes but also on sidesurfaces of the other internal electrodes.

Referring to FIGS. 15 to 17, it can be seen that the third internalelectrodes 323 having different polarities may be arranged above andbelow the first internal electrode 321, and the second internalelectrodes 322 having different polarities may be arranged on sidesurfaces of the first internal electrode 321.

Similarly, the second internal electrodes 322 having differentpolarities may be arranged above and below the fourth internal electrode324, and the third internal electrodes 323 having different polaritiesmay be arranged on side surfaces of the fourth internal electrode 324.

The first external electrode 131 may be disposed on the third surface 3of the body to be connected to the first and fourth internal electrodes321 and 324 and the first and fourth lead portions 321 a and 324 a. Thesecond external electrode 132 may be disposed on the fourth surface 4 ofthe body to be connected to the second and third internal electrodes 322and 323 and the second and third lead portions 322 a and 323 a.

In addition, since a bent portion of the first external electrode 131contacts the first and fourth lead portions 321 a and 324 a, and a bentportion of the second external electrode 132 contacts the second andthird lead portions 322 a and 323 a, connectivity between the internalelectrodes 321, 322, 323, and 324 and the external electrodes 131 and132 may be improved, and an equivalent series resistance (ESR) may belowered.

One of various effects of the present disclosure is to secure a goodmechanical strength by disposing the spacer in the central portion ofthe internal electrode layer.

One of various effects of the present disclosure is to improve thereliability for moisture resistance.

One of various effects of the present disclosure is to suppress theoccurrence of delamination of the capacity forming portion and the coverportion, the occurrence of cracking, or the like.

One of various effects of the present disclosure is to prevent the poorcontact between the internal electrode and the external electrode.

However, various and advantageous advantages and effects of the presentdisclosure are not limited to the above description, and can be morereadily understood in the process of describing the specific embodimentsof the present disclosure.

While example embodiments have been illustrated and described above, itwill be apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween, and comprising first and second surfaces opposing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a first external electrode disposed to extend from the third surface to a portion of the fifth and sixth surfaces; and a second external electrode disposed to extend from the fourth surface to a portion of the fifth and sixth surfaces, wherein the first internal electrode layer comprises first and second internal electrodes connected to the first external electrode on the third surface and arranged with a first spacer interposed therebetween, a first lead portion connected to the first internal electrode and connected to the first external electrode on the third and sixth surfaces, and a second lead portion connected to the second internal electrode and connected to the first external electrode on the third and fifth surfaces, and wherein the second internal electrode layer comprises third and fourth internal electrodes connected to the second external electrode on the fourth surface and arranged with a second spacer interposed therebetween, a third lead portion connected to the third internal electrode and connected to the second external electrode on the fourth and sixth surfaces, and a fourth lead portion connected to the fourth internal electrode and connected to the second external electrode on the fourth and fifth surfaces.
 2. The multilayer electronic component according to claim 1, wherein the dielectric layers disposed above and below the first internal electrode layer are connected to each other by the first spacer, and the dielectric layers disposed above and below the second internal electrode layer are connected to each other by the second spacer.
 3. The multilayer electronic component according to claim 1, wherein a dielectric is disposed in the first and second spacers.
 4. The multilayer electronic component according to claim 1, wherein a width of the first spacer is 5% or more and 30% or less of a width of the body, and a width of the second spacer is 5% or more and 30% or less of the width of the body.
 5. The multilayer electronic component according to claim 1, wherein the first spacer and the second spacer are stacked not to overlap each other in the stacking direction.
 6. The multilayer electronic component according to claim 1, wherein widths of the first and second internal electrodes are different from each other, and widths of the third and fourth internal electrodes are different from each other.
 7. The multilayer electronic component according to claim 1, wherein the body further comprises at least one of a third internal electrode layer comprising a fifth internal electrode exposed from the third surface, and a fourth internal electrode layer comprising a sixth internal electrode exposed from the fourth surface.
 8. The multilayer electronic component according to claim 7, wherein the fifth internal electrode is the only internal electrode included in the third internal electrode layer, and the sixth internal electrode is the only internal electrode included in the fourth internal electrode layer.
 9. The multilayer electronic component according to claim 1, wherein the first lead portion and the second lead portion are spaced apart from each other, and the third lead portion and the fourth lead portion are spaced apart from each other.
 10. A multilayer electronic component comprising: a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween, and comprising first and second surfaces opposing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a first external electrode disposed to extend from the third surface to a portion of the fifth and sixth surfaces; and a second external electrode disposed to extend from the fourth surface to a portion of the fifth and sixth surfaces, wherein the first internal electrode layer comprises first and second internal electrodes arranged with a first spacer interposed therebetween, a first lead portion connected to the first internal electrode and connected to the first external electrode on the third and sixth surfaces, and a second lead portion connected to the second internal electrode and connected to the second external electrode on the fourth and fifth surfaces, wherein the second internal electrode layer comprises third and fourth internal electrodes arranged with a second spacer interposed therebetween, a third lead portion connected to the third internal electrode and connected to the second external electrode on the fourth and sixth surfaces, and a fourth lead portion connected to the fourth internal electrode and connected to the first external electrode on the third and fifth surfaces, wherein the first and fourth internal electrodes are connected to the first external electrode on the third surface, and the second and third internal electrodes are connected to the second external electrode on the fourth surface.
 11. The multilayer electronic component according to claim 10, wherein the dielectric layers disposed above and below the first internal electrode layer are connected to each other by the first spacer, and the dielectric layers disposed above and below the second internal electrode layer are connected to each other by the second spacer.
 12. The multilayer electronic component according to claim 10, wherein a dielectric is disposed in the first and second spacers.
 13. The multilayer electronic component according to claim 10, wherein a width of the first spacer is 5% or more and 30% or less of a width of the body, and a width of the second spacer is 5% or more and 30% or less of the width of the body.
 14. The multilayer electronic component according to claim 10, wherein the first spacer and the second spacer are stacked not to overlap each other in the stacking direction.
 15. The multilayer electronic component according to claim 10, wherein widths of the first and second internal electrodes are different from each other, and widths of the third and fourth internal electrodes are different from each other.
 16. The multilayer electronic component according to claim 10, wherein the body further comprises at least one of a third internal electrode layer comprising a fifth internal electrode exposed from the third surface, and a fourth internal electrode layer comprising a sixth internal electrode exposed from the fourth surface.
 17. The multilayer electronic component according to claim 16, wherein the fifth internal electrode is the only internal electrode included in the third internal electrode layer, and the sixth internal electrode is the only internal electrode included in the fourth internal electrode layer. 